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SN74LS174 Hex D Flip-Flop
The LSTTL / MSI SN74LS174 is a high speed Hex D Flip-Flop. The device is used primarily as a 6-bit edge-triggered storage register. The information on the D inputs is transferred to storage during the LOW to HIGH clock transition. The device has a Master Reset to simultaneously clear all flip-flops. The LS174 is fabricated with the Schottky barrier diode process for high speed and is completely compatible with all ON Semiconductor TTL families.
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* * * *
Edge-Triggered D-Type Inputs Buffered-Positive Edge-Triggered Clock Asynchronous Common Reset Input Clamp Diodes Limit High Speed Termination Effects
LOW POWER SCHOTTKY
GUARANTEED OPERATING RANGES
Symbol VCC TA IOH IOL Parameter Supply Voltage Operating Ambient Temperature Range Output Current - High Output Current - Low Min 4.75 0 Typ 5.0 25 Max 5.25 70 - 0.4 8.0 Unit V C mA mA
16 1
PLASTIC N SUFFIX CASE 648
16 1
SOIC D SUFFIX CASE 751B
ORDERING INFORMATION
Device SN74LS174N SN74LS174D Package 16 Pin DIP 16 Pin Shipping 2000 Units/Box 2500/Tape & Reel
(c) Semiconductor Components Industries, LLC, 1999
1
December, 1999 - Rev. 6
Publication Order Number: SN74LS174/D
SN74LS174
CONNECTION DIAGRAM DIP (TOP VIEW)
VCC 16 Q5 15 D5 14 D4 13 Q4 12 D3 11 Q3 10 CP 9 NOTE: The Flatpak version has the same pinouts (Connection Diagram) as the Dual In-Line Package. 1 MR 2 Q0 3 D0 4 D1 5 Q1 6 D2 7 Q2 8 GND
LOADING (Note a) PIN NAMES D0 - D5 CP MR Q0 - Q5 Data Inputs Clock (Active HIGH Going Edge) Input Master Reset (Active LOW) Input Outputs HIGH 0.5 U.L. 0.5 U.L. 0.5 U.L. 10 U.L. LOW 0.25 U.L. 0.25 U.L. 0.25 U.L. 5 U.L.
NOTES: a) 1 TTL Unit Load (U.L.) = 40 mA HIGH/1.6 mA LOW.
LOGIC SYMBOL
3 4 6 11 13 14
9 1
D0 D1 D2 D3 D4 D5 CP MR Q0 Q1 Q2 Q3 Q4 Q5
2 5 7 10 12 15 VCC = PIN 16 GND = PIN 8
LOGIC DIAGRAM
MR CP D5
1 9 14
D4
13
D3
11
D2
6
D1
4
D0
3
DQ CP CD
15
DQ CP CD
12
DQ CP CD
10
DQ CP CD
7
DQ CP CD
5
DQ CP CD
2
Q5
Q4 VCC = PIN 16 GND = PIN 8
Q3
Q2
Q1
Q0
= PIN NUMBERS
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SN74LS174
FUNCTIONAL DESCRIPTION
The LS174 consists of six edge-triggered D flip-flops with individual D inputs and Q outputs. The Clock (CP) and Master Reset (MR) are common to all flip-flops. Each D input's state is transferred to the corresponding flip-flop's output following the LOW to HIGH Clock (CP) transition.
A LOW input to the Master Reset (MR) will force all outputs LOW independent of Clock or Data inputs. The LS174 is useful for applications where the true output only is required and the Clock and Master Reset are common to all storage elements.
TRUTH TABLE
Inputs (t = n, MR = H) D H L
Note 1: t = n + 1 indicates conditions after next clock.
Outputs (t = n+1) Note 1 Q H L
DC CHARACTERISTICS OVER OPERATING TEMPERATURE RANGE (unless otherwise specified)
Limits Symbol VIH VIL VIK VOH Parameter Input HIGH Voltage Input LOW Voltage Input Clamp Diode Voltage Output HIGH Voltage 2.7 - 0.65 3.5 0.25 VO OL Output LOW Voltage 0.35 IIH IIL IOS ICC Input HIGH Current 0.1 Input LOW Current Short Circuit Current (Note 1) Power Supply Current - 20 - 0.4 - 100 26 0.5 20 V A mA mA mA mA IOL = 8.0 mA 0.4 Min 2.0 0.8 - 1.5 Typ Max Unit V V V V V Test Conditions Guaranteed Input HIGH Voltage for All Inputs Guaranteed Input LOW Voltage for All Inputs VCC = MIN, IIN = - 18 mA VCC = MIN, IOH = MAX, VIN = VIH or VIL per Truth Table IOL = 4.0 mA VCC = VCC MIN, VIN = VIL or VIH per Truth Table
VCC = MAX, VIN = 2.7 V VCC = MAX, VIN = 7.0 V VCC = MAX, VIN = 0.4 V VCC = MAX VCC = MAX
Note 1: Not more than one output should be shorted at a time, nor for more than 1 second.
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SN74LS174
AC CHARACTERISTICS (TA = 25C)
Limits Symbol fMAX tPHL tPLH tPHL Parameter Maximum Input Clock Frequency Propagation Delay, MR to Output Propagation Delay, Clock to Output Min 30 Typ 40 23 20 21 35 30 30 Max Unit MHz ns ns VCC = 5.0 V CL = 15 pF F Test Conditions
AC SETUP REQUIREMENTS (TA = 25C)
Limits Symbol tW ts th trec Parameter Clock or MR Pulse Width Data Setup Time Data Hold Time Recovery Time Min 20 20 5.0 25 Typ Max Unit ns ns ns ns VCC = 5 0 V 5.0 Test Conditions
AC WAVEFORMS
1/fmax tw CP 1.3 V ts(H) D * 1.3 V th(H) ts(L) 1.3 V th(L) 1.3 V tPHL 1.3 V CP Q tPHL 1.3 V 1.3 V MR 1.3 V tW 1.3 V trec 1.3 V
1.3 V tPLH 1.3 V
Q
*The shaded areas indicate when the input is permitted to *change for predictable output performance.
Figure 1. Clock to Output Delays, Clock Pulse Width, Frequency, Setup and Hold Times Data to Clock
Figure 2. Master Reset to Output Delay, Master Reset Pulse Width, and Master Reset Recovery Time
DEFINITIONS OF TERMS
SETUP TIME (ts) -- is defined as the minimum time required for the correct logic level to be present at the logic input prior to the clock transition from LOW to HIGH in order to be recognized and transferred to the outputs. HOLD TIME (th) -- is defined as the minimum time following the clock transition from LOW to HIGH that the logic level must be maintained at the input in order to ensure
continued recognition. A negative HOLD TIME indicates that the correct logic level may be released prior to the clock transition from LOW to HIGH and still be recognized. RECOVERY TIME (trec) -- is defined as the minimum time required between the end of the reset pulse and the clock transition from LOW to HIGH in order to recognize and transfer HIGH Data to the Q outputs.
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SN74LS174
PACKAGE DIMENSIONS
N SUFFIX PLASTIC PACKAGE CASE 648-08 ISSUE R
-A-
16 9 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL. 4. DIMENSION B DOES NOT INCLUDE MOLD FLASH. 5. ROUNDED CORNERS OPTIONAL. DIM A B C D F G H J K L M S INCHES MIN MAX 0.740 0.770 0.250 0.270 0.145 0.175 0.015 0.021 0.040 0.70 0.100 BSC 0.050 BSC 0.008 0.015 0.110 0.130 0.295 0.305 0_ 10 _ 0.020 0.040 MILLIMETERS MIN MAX 18.80 19.55 6.35 6.85 3.69 4.44 0.39 0.53 1.02 1.77 2.54 BSC 1.27 BSC 0.21 0.38 2.80 3.30 7.50 7.74 0_ 10 _ 0.51 1.01
B
1 8
F S
C
L
-T- H G D
16 PL
SEATING PLANE
K
J TA
M
M
0.25 (0.010)
M
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SN74LS174
PACKAGE DIMENSIONS
D SUFFIX PLASTIC SOIC PACKAGE CASE 751B-05 ISSUE J
-A-
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. MILLIMETERS MIN MAX 9.80 10.00 3.80 4.00 1.35 1.75 0.35 0.49 0.40 1.25 1.27 BSC 0.19 0.25 0.10 0.25 0_ 7_ 5.80 6.20 0.25 0.50 INCHES MIN MAX 0.386 0.393 0.150 0.157 0.054 0.068 0.014 0.019 0.016 0.049 0.050 BSC 0.008 0.009 0.004 0.009 0_ 7_ 0.229 0.244 0.010 0.019
16
9
-B-
1 8
P
8 PL
0.25 (0.010)
M
B
S
G F
K C -T-
SEATING PLANE
R
X 45 _
M D
16 PL M
J
0.25 (0.010)
TB
S
A
S
DIM A B C D F G J K M P R
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SN74LS174
Notes
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SN74LS174
ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer.
PUBLICATION ORDERING INFORMATION
North America Literature Fulfillment: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303-675-2175 or 800-344-3860 Toll Free USA/Canada Fax: 303-675-2176 or 800-344-3867 Toll Free USA/Canada Email: ONlit@hibbertco.com N. American Technical Support: 800-282-9855 Toll Free USA/Canada EUROPE: LDC for ON Semiconductor - European Support German Phone: (+1) 303-308-7140 (M-F 2:30pm to 5:00pm Munich Time) Email: ONlit-german@hibbertco.com French Phone: (+1) 303-308-7141 (M-F 2:30pm to 5:00pm Toulouse Time) Email: ONlit-french@hibbertco.com English Phone: (+1) 303-308-7142 (M-F 1:30pm to 5:00pm UK Time) Email: ONlit@hibbertco.com ASIA/PACIFIC: LDC for ON Semiconductor - Asia Support Phone: 303-675-2121 (Tue-Fri 9:00am to 1:00pm, Hong Kong Time) Toll Free from Hong Kong 800-4422-3781 Email: ONlit-asia@hibbertco.com JAPAN: ON Semiconductor, Japan Customer Focus Center 4-32-1 Nishi-Gotanda, Shinagawa-ku, Tokyo, Japan 141-8549 Phone: 81-3-5487-8345 Email: r14153@onsemi.com Fax Response Line: 303-675-2167 800-344-3810 Toll Free USA/Canada ON Semiconductor Website: http://onsemi.com For additional information, please contact your local Sales Representative.
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SN74LS174/D

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